CuMn7Sn Copper Manganese Tin Alloy Strip Inoshandiswa kune Chip Resistors
CHEMICAL COMPOSITION
Mn% | Sn% | Cu% | |
Nominal Composition | 7 | 2.5 | Bal. |
ZVINHU ZVINHU
Density g/cm3 | 8.5 |
TCR 10-6/K | ±10 |
Elastic Modulus GPA | 125 |
Thermal Conductivity W/(m·K) | 35 |
Thermal yekuwedzera coefficient 10-6/ K | 21.6 |
EMF μV/K | -1 |
Resistivity Ohm mm2/m | 0.29+/-0.04 |
MACHHANICAL PROPERTIES
State | Goho simba | Kusimba simba | Elongation | Kuoma |
Mpa | MPa | % | HV | |
R350 | - | 350 | 30 | 70 |